BGM111A256V2R

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Manufacturer part number:BGM111A256V2R

Manufacturer:Silicon Labs

Description:2.4GHz Bluetooth -40°C~85°C 1.85V~3.8V I2C, SPI, UART Tape & Reel (TR) Integrated, Chip 1Mbps 8dBm Bluetooth v4.2 -92dBm Module

Case Package:SOT-23

Datasheet:BGM111A256V2R Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	Module
Surface Mount	YES
Operating Temperature	-40°C~85°C
Packaging	Tape & Reel (TR)
Published	2016
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	31
HTS Code	8542.39.00.01
Voltage - Supply	1.85V~3.8V
Terminal Position	UNSPECIFIED
Terminal Form	NO LEAD
Number of Functions	1
Supply Voltage	3.3V
Terminal Pitch	1.2mm
Frequency	2.4GHz
JESD-30 Code	R-XXMA-N31
Interface	I2C, SPI, UART
Memory Size	256kB Flash 32kB RAM
Nominal Supply Current	200mA
Data Rate	1Mbps
Utilized IC / Part	EFR32BG
Protocol	Bluetooth v4.2
Telecom IC Type	TELECOM CIRCUIT
Power - Output	8dBm
RF Family/Standard	Bluetooth
Antenna Type	Integrated, Chip
Sensitivity	-92dBm
Serial Interfaces	I2C, SPI, UART
Current - Receiving	8.7mA
Current - Transmitting	8.2mA
Modulation	GFSK
Number of GPIO	25
Ambient Temperature Range High	85°C
Height	2.2mm
Length	15mm
Width	12.9mm
RoHS Status	Non-RoHS Compliant