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SI32170-B-GM1R

SI32170-B-GM1R

SI32170-B-GM1R

Silicon Labs

Telecom device1 Circuits

SOT-23

SI32170-B-GM1R Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 42-WFQFN Exposed Pad
Packaging Tape & Reel (TR)
Published 2000
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface PCM, SPI
Number of Circuits 1
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
SI32170-B-GM1R Product Details

SI32170-B-GM1R Overview


Space is saved on the board by using the 42-WFQFN Exposed Pad package.For telecommunications equipment packing, the Tape & Reel (TR) method is used.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .

SI32170-B-GM1R Features


Available in the 42-WFQFN Exposed Pad package

SI32170-B-GM1R Applications


There are a lot of Silicon Labs SI32170-B-GM1R Telecom applications.

  • Channel Banks
  • Interfaces to E3
  • Hybrid fiber coax (HFC)
  • PDH Multiplexers
  • Wireless base stations
  • Central office
  • Network Multiplexing and Terminating Equipment
  • Wireless local loop (WLL)
  • DECT (Digital European Cordless Telephone) Base
  • PBXs channel bank

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