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SI32266-C-FMR

SI32266-C-FMR

SI32266-C-FMR

Silicon Labs

Telecom device1 Circuits

SOT-23

SI32266-C-FMR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Series ProSLICĀ®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant
SI32266-C-FMR Product Details

SI32266-C-FMR Overview


A QFN package saves space on a board.Packing is done according to the Tape & Reel (TR) method.Telecommunications equipment is mounted using Surface Mount.1 circuits make up this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 3.3V can be operated more efficiently.Mounted in the direction of Surface Mount.The telecom IC type is DIGITAL SLIC.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the ProSLIC? series.

SI32266-C-FMR Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32266-C-FMR Applications


There are a lot of Silicon Labs SI32266-C-FMR Telecom applications.

  • Frame Relay Switches and Access Devices (FRADS)
  • Channel Service Units (CSUs): T1/E1/J1
  • SONET/SDH terminal
  • ISDN Primary Rate Interfaces (PRA)
  • NIU
  • Home Gateway
  • Microwave transmission systems
  • ATM equipment with integrated DS1 interfaces
  • Cable Modem
  • Integrated Multi-Service Access Platforms (IMAPs)

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