SI32266-C-GM1 Overview

A QFN package is used to reduce board space requirements.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A Surface Mount-axis mounts telecom switching.DIGITAL SLIC is the type of IC it uses for telecom.This part can perform many functions similar to the electronic parts under the ProSLIC? series.

SI32266-C-GM1 Features

Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32266-C-GM1 Applications

There are a lot of Silicon Labs SI32266-C-GM1 Telecom applications.

• T1/E1/J1 Multiplexer and Channel Banks
• Multi-Line E1 Interface Cards
• Codec function on telephone switch line cards
• ATM Switches
• Channel Service Units (CSUs): T1/E1/J1
• Integrated Multi-Service Access Platforms (IMAPs)
• Digital cross connects (DSX-1)
• Stations
• DECT (Digital European Cordless Telephone) Base
• E1 Multiplexer