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SI32266-C-GM1R

SI32266-C-GM1R

SI32266-C-GM1R

Silicon Labs

Telecom device1 Circuits

SOT-23

SI32266-C-GM1R Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Published 2000
Series ProSLICĀ®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
SI32266-C-GM1R Product Details

SI32266-C-GM1R Overview


Space is saved on the board by using the QFN package.Telecommunications equipment is packed according to Tape & Reel (TR)'s method.In this case, Surface Mount is the mounting type.An 1-circuit makes up this telecom IC .When 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Surface Mount is the way telecom switching is mounted.Telecom ICs are of type DIGITAL SLIC.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the ProSLIC? series.

SI32266-C-GM1R Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32266-C-GM1R Applications


There are a lot of Silicon Labs SI32266-C-GM1R Telecom applications.

  • E3/DS3 Access Equipment
  • T1/E1/J1 LAN/WAN Routers
  • Fiber
  • Interfaces to E3
  • Private branch exchange (PBX)
  • Interfaces to DS3
  • Set-Top Box
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • ISDN Primary Rate Interfaces (PRA)
  • DECT (Digital European Cordless Telephone) Base

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