SI32269-C-GM1 Overview

In order to save space on the board, the QFN package is used.Telecommunications equipment is packed in the Tray-way.A Surface Mount mounting type is used.Telecommunications equipment consists of 1 circuits.Providing 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Mounted in the direction of Surface Mount.As its telecom IC type, it uses DIGITAL SLIC.There are many similarities between it and the electronic parts of the ProSLIC? series.

SI32269-C-GM1 Features

Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32269-C-GM1 Applications

There are a lot of Silicon Labs SI32269-C-GM1 Telecom applications.

• Digital access cross connects
• Residential Gateways
• Integrated Access Devices (IADs)
• Stations
• High speed data transmission line cards
• Digital Cross-connect Systems (DCS)
• Public switching systems
• Add/Drop multiplexers (ADMs)
• Interfaces to DS3
• Inverse Multiplexing for ATM (IMA)