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SI32269-C-GM1R

SI32269-C-GM1R

SI32269-C-GM1R

Silicon Labs

Telecom device1 Circuits

SOT-23

SI32269-C-GM1R Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 50-QFN (6x8)
Packaging Tape & Reel (TR)
Published 2014
Series ProSLICĀ®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.3V
Function Subscriber Line Interface Concept (SLIC), CODEC
Interface GCI, PCM, SPI
Number of Circuits 1
Telecom IC Type DIGITAL SLIC
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
SI32269-C-GM1R Product Details

SI32269-C-GM1R Overview


QFN package is used to save board space.The way of Tape & Reel (TR) is employed for telecommunications equipment packing.The mounting type is Surface Mount.The telecom IC is composed of 1 circuits.The voltage supplied to 3.3V can improve efficiency.Mounted in the direction of Surface Mount.It uses a DIGITAL SLIC type telecom IC.The ProSLIC? series is capable of providing a number of similar functions to the W series.

SI32269-C-GM1R Features


Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32269-C-GM1R Applications


There are a lot of Silicon Labs SI32269-C-GM1R Telecom applications.

  • T1/E1/J1 LAN/WAN Routers
  • Cable modem
  • Digital subscriber line access multiplexer (DSLAM)
  • ISDN terminal adapter
  • BITS Timing
  • Fiber
  • Cable Modem
  • Switching Systems
  • Routers
  • Multi-Line E1 Interface Cards

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