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SI4704-D60-GMR

SI4704-D60-GMR

SI4704-D60-GMR

Silicon Labs

SI4704-D60-GMR datasheet pdf and RF Receivers product details from Silicon Labs stock available on our website

SOT-23

SI4704-D60-GMR Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Package / Case 20-UFQFN Exposed Pad
Surface Mount YES
Number of Pins 20
Weight 50.008559mg
Operating Temperature -20°C~85°C
Packaging Tape & Reel (TR)
Published 1997
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
ECCN Code EAR99
Applications General Purpose
HTS Code 8542.39.00.01
Subcategory Other Consumer ICs
Technology CMOS
Voltage - Supply 2.7V~5.5V
Terminal Position QUAD
Number of Functions 1
Terminal Pitch 0.5mm
Depth 3mm
Frequency 64MHz~108MHz
Pin Count 20
Operating Supply Voltage 5.5V
Power Supplies 1.8/3.33/5V
Supply Voltage-Min (Vsup) 2.7V
Operating Supply Current 8.2mA
Data Interface PCB, Surface Mount
Consumer IC Type AUDIO SINGLE CHIP RECEIVER
Signal to Noise Ratio (SNR) 58 dB
Current - Receiving 10.5mA
Modulation or Protocol FM
Harmonic Distortion 0.1%
Antenna Connector PCB, Surface Mount
Output Voltage-Nom (FM) 80mV
Demodulation Type FM
Height Seated (Max) 0.6mm
Length 3mm
Radiation Hardening No
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,500 $1.63850 $3.277
SI4704-D60-GMR Product Details

SI4704-D60-GMR Overview


The 20-UFQFN Exposed Pad package includes RF Receiver as a convenience.The package of RF transmitter and receiver is in the form of Tape & Reel (TR).This RF Receiver has a supply voltage of 2.7V~5.5V.In General Purpose, it is primarily used.QUAD is the position of RF transmitter and receiver's terminals on the board.When working at a frequency of 64MHz~108MHz it is able to achieve excellent efficiency.There are a total of 20 terminations of RF Receiver associated with it.

SI4704-D60-GMR Features


20-UFQFN Exposed Pad package
64MHz~108MHz
20 terminations

SI4704-D60-GMR Applications


There are a lot of Silicon Labs SI4704-D60-GMR RF Receivers applications.

  • Embedded Processor
  • Wireless infrastructure
  • Inverters
  • Optical transmission devices
  • Satellites
  • Microwave radios
  • Keyless Entry Systems
  • Low Bitrate ISM-band Communication Systems
  • GSM
  • Microprocessor

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