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SI53304-B-GMR

SI53304-B-GMR

SI53304-B-GMR

Silicon Labs

1 Circuit 725MHz 2:6 Clock Buffer SI53304 32-VFQFN Exposed Pad

SOT-23

SI53304-B-GMR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 32-VFQFN Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 1997
Part Status Active
Moisture Sensitivity Level (MSL) 2 (1 Year)
Type Fanout Buffer (Distribution), Multiplexer, Translator
Voltage - Supply 1.71V~3.63V
Base Part Number SI53304
Output CML, HCSL, LVCMOS, LVDS, LVPECL
Number of Circuits 1
Frequency (Max) 725MHz
Input CML, HCSL, LVCMOS, LVDS, LVPECL
Ratio - Input:Output 2:6
Differential - Input:Output Yes/Yes
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $6.49000 $6.49
500 $6.4251 $3212.55
1000 $6.3602 $6360.2
1500 $6.2953 $9442.95
2000 $6.2304 $12460.8
2500 $6.1655 $15413.75
SI53304-B-GMR Product Details

SI53304-B-GMR Overview


The clock divider is packaged in a 32-VFQFN Exposed Pad case. In case Tape & Reel (TR), the cut smart buffer is available. It is normal to operate with a value of 725MHz. A mount of Surface Mount has been applied to it. Electronic parts classified as Fanout Buffer (Distribution), Multiplexer, Translator are considered to be safety components. To ensure reliable performance, the temperature should be set to -40°C~85°C. It should be able to work with a power source of 1.71V~3.63VV. As a result, it is placed in the way of Surface Mount. There is a value of CML, HCSL, LVCMOS, LVDS, LVPECL as the output. This is a member of the SI53304 family.

SI53304-B-GMR Features


The operating temperature of -40°C~85°C degrees

SI53304-B-GMR Applications


There are a lot of Silicon Labs SI53304-B-GMR Clock Buffers & Drivers applications.

  • High-performance server
  • Storage area network
  • High reliability telecommunication system
  • Medical imaging
  • Clock signal duplication
  • Information equipment
  • Network attached storage
  • 5G
  • Wireless infrastructure equipment
  • Smartphone

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