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SI53340-B-GMR

SI53340-B-GMR

SI53340-B-GMR

Silicon Labs

1 Circuit 1.25GHz 2:4 Clock Buffer QUAD SI53340 16-VFQFN Exposed Pad

SOT-23

SI53340-B-GMR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-VFQFN Exposed Pad
Number of Pins 16
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 1997
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 2 (1 Year)
Number of Terminations 16
Type Fanout Buffer (Distribution), Multiplexer
Terminal Finish Matte Tin (Sn)
Subcategory Clock Drivers
Voltage - Supply 1.71V~3.63V
Terminal Position QUAD
Terminal Form NO LEAD
Terminal Pitch 0.5mm
Base Part Number SI53340
Output CML, HCSL, LVCMOS, LVDS, LVPECL
Qualification Status Not Qualified
Number of Circuits 1
Nominal Supply Current 140mA
Frequency (Max) 1.25GHz
Input CML, HCSL, LVCMOS, LVDS, LVPECL
Ratio - Input:Output 2:4
Differential - Input:Output Yes/Yes
Max Duty Cycle 53 %
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,000 $1.31828 $1.31828
SI53340-B-GMR Product Details

SI53340-B-GMR Overview


It is package in 16-VFQFN Exposed Pad case. There is a Tape & Reel (TR) package attached to it. Normal operation has a maximum value of 1.25GHz. It has 16 terminations. In this case, it is set up as Surface Mount. Electronic components classified as Fanout Buffer (Distribution), Multiplexer fall into this category. To ensure reliable performance, the temperature should be set to -40°C~85°C. 1.71V~3.63V V power should work with it. It is located in the way of Surface Mount. There is a value of CML, HCSL, LVCMOS, LVDS, LVPECL as the output. It is operated using the 16 pins. It is a member of the SI53340 family. It is contained in Clock Drivers.

SI53340-B-GMR Features


16 terminations
The operating temperature of -40°C~85°C degrees
Clock Drivers subcategory

SI53340-B-GMR Applications


There are a lot of Silicon Labs SI53340-B-GMR Clock Buffers & Drivers applications.

  • Data communication
  • Mass storage system
  • High performance communication system
  • Synchronous optical network (SONET)
  • Hardware accelerator
  • Ultra Mobile PC (UMPC)
  • Wireless infrastructure equipment
  • Information equipment
  • Storage area network
  • DDR4 JEDEC standard RDIMM design

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