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SI5342D-D06495-GM

SI5342D-D06495-GM

SI5342D-D06495-GM

Silicon Labs

1.8V Clock Generators 44 Terminals Tray

SOT-23

SI5342D-D06495-GM Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Surface Mount YES
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 2 (1 Year)
Number of Terminations 44
Technology CMOS
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 0.5mm
[email protected] Reflow Temperature-Max (s) 40
JESD-30 Code S-XQCC-N44
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Supply Voltage-Max (Vsup) 1.89V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.71V
uPs/uCs/Peripheral ICs Type CLOCK GENERATOR, PROCESSOR SPECIFIC
Primary Clock/Crystal Frequency-Nom 750MHz
Output Clock Frequency-Max 350MHz
Height Seated (Max) 0.9mm
Length 7mm
Width 7mm
RoHS Status ROHS3 Compliant
SI5342D-D06495-GM Product Details

SI5342D-D06495-GM Overview


This clock IC is packaged using the Tray method. This clock generator will sustain a maximum temperature of 260 when reflown. As you can see, it consists of 44 terminations. This clock generator ic should receive a voltage of 1.8V. The maximum voltage this clock PLL can handle is 1.89V. This RF synthesizer has CLOCK GENERATOR, PROCESSOR SPECIFIC uPs, uCs, and peripheral ICs. For safety reasons, this frequency synthesizer should have a voltage supply above 1.71V. A frequency generator that runs over 85°C may cause ha85°Cards. The clock generator ic can synthesi350MHze a high-quality clock output frequency of 350MHz. If the ambient temperature is below -40°C, the clock PLL may not start up.

SI5342D-D06495-GM Features


Supply voltage of 1.8V
Output clock frequency (Max) of 350MHz

SI5342D-D06495-GM Applications


There are a lot of Silicon Labs SI5342D-D06495-GM Clock Generators applications.

  • Modems
  • Cell phones
  • Phase modulation cellular systems
  • Peripheral devices
  • Small signal recovery
  • Pagers
  • Wide area power system
  • Bluetooth receivers
  • Communication infrastructure
  • CPUs

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