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SI5382E-E-GM

SI5382E-E-GM

SI5382E-E-GM

Silicon Labs

Clock Jitter Attenuator 735MHz 2.94912GHz Clock Generators 64-VFQFN Exposed Pad Surface Mount 1.71V~3.47V Tray

SOT-23

SI5382E-E-GM Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 64-VFQFN Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
ECCN Code EAR99
Type Clock Jitter Attenuator
Voltage - Supply 1.71V~3.47V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Output HCSL, LVCMOS, LVDS, LVPECL
Number of Circuits 2
Frequency (Max) 735MHz 2.94912GHz
Input LVCMOS, Crystal
Ratio - Input:Output 4:12
PLL Yes
Differential - Input:Output Yes/Yes
Divider/Multiplier Yes/No
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
260 $14.86938 $3866.0388
SI5382E-E-GM Product Details

SI5382E-E-GM Overview


The Tray method is used for packaging clock ICs. As part of the 64-VFQFN Exposed Pad package, this clock generator is embedded. This clock generator ic can sustain NOT SPECIFIED degrees of temperature during reflowing. In this clock generator, LVCMOS, Crystal is used as the input to the clock. For a full understanding of the electronic part's performance, 2 circuits are implemented. An up to 735MHz 2.94912GHz frequency is provided by this clock-based RF synthesizer. The Surface Mount allows the electrical component to be installed conveniently on the panel. In terms of supply voltage, RF synthesizer works with 1.71V~3.47V. Test statistics estimate a temperature of -40°C~85°C, which should be set as the ambient temperature. The frequency synthesizer in this product is compatible with all levels of HCSL, LVCMOS, LVDS, LVPECL logic. It has been classified as a Clock Jitter Attenuator electronic part, which means that it is a semiconductor.

SI5382E-E-GM Features


Available in the 64-VFQFN Exposed Pad


SI5382E-E-GM Applications


There are a lot of Silicon Labs
SI5382E-E-GM Clock Generators applications.


  • Wireless base station for LTE, LTE-advanced
  • Picocells, femtocells and small cells
  • Sampling clocks for ADC and DAC
  • 1 Gigabit Ethernet
  • 10 Gigabit Ethernet
  • FPGA and processor clocks
  • Line cards used in telephone exchange
  • Fiber Channel
  • PCI express cards
  • Infotainment systems

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