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RMCF2010FT196K

RMCF2010FT196K

RMCF2010FT196K

Stackpole Electronics Inc

Res Thick Film 2010 196K Ohm 1% 3/4W 100ppm/C Molded SMD SMD Paper T/R

SOT-23

RMCF2010FT196K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Package / Case 2010 (5025 Metric)
Surface MountYES
Terminal Shape WRAPAROUND
Mounting FeatureSURFACE MOUNT
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2012
Series RMCF
Size / Dimension 0.197Lx0.098W 5.00mmx2.50mm
Tolerance ±1%
JESD-609 Code e3
Feature Automotive AEC-Q200
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±100ppm/°C
Resistance 196kOhm
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Composition Thick Film
Power (Watts) 0.75W 3/4W
Packing Method TR, Plastic, 7 Inch
Construction Rectangular
Resistor Type FIXED RESISTOR
Rated Power Dissipation (P) 0.75W
Height Seated (Max) 0.028 0.70mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:183713 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About RMCF2010FT196K

The RMCF2010FT196K from Stackpole Electronics Inc is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thick Film 2010 196K Ohm 1% 3/4W 100ppm/C Molded SMD SMD Paper T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RMCF2010FT196K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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