STM32F769NIH6

Name	Value
Type	Parameter
Lifecycle Status	ACTIVE (Last Updated: 7 months ago)
Factory Lead Time	12 Weeks
Mounting Type	Surface Mount
Package / Case	216-TFBGA
Surface Mount	YES
Number of Pins	216
Operating Temperature	-40°C~85°C TA
Packaging	Tray
Series	STM32F7
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	216
Additional Feature	ALSO SUPPORTS MIPI-DSI, SPDIFRX RECEIVER INTERFACE
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Supply Voltage	1.8V
Terminal Pitch	0.8mm
Frequency	216MHz
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Base Part Number	STM32F769
Supply Voltage-Max (Vsup)	3.6V
Supply Voltage-Min (Vsup)	1.7V
Interface	CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB
Memory Size	2MB
Oscillator Type	Internal
Number of I/O	168
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	1.7V~3.6V
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC
Core Processor	ARM® Cortex®-M7
Peripherals	Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Program Memory Type	FLASH
Core Size	32-Bit
Program Memory Size	2MB 2M x 8
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG
Bit Size	32
Data Converter	A/D 24x12b; D/A 2x12b
Has ADC	YES
DMA Channels	YES
PWM Channels	YES
DAC Channels	YES
Address Bus Width	26
ROM (words)	2097152
Core Architecture	ARM
On Chip Program ROM Width	8
External Data Bus Width	32
Length	13mm
Height Seated (Max)	1.1mm
Width	13mm
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant

Name

Value

Type

Parameter

Lifecycle Status

ACTIVE (Last Updated: 7 months ago)

Factory Lead Time

12 Weeks

Mounting Type

Surface Mount

Package / Case

216-TFBGA

Surface Mount

YES

Number of Pins

216

Operating Temperature

-40°C~85°C TA

Packaging

Tray

Series

STM32F7

Part Status

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

216

Additional Feature

ALSO SUPPORTS MIPI-DSI, SPDIFRX RECEIVER INTERFACE

Terminal Position

BOTTOM

Terminal Form

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Supply Voltage

1.8V

Terminal Pitch

0.8mm

Frequency

216MHz

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

STM32F769

Supply Voltage-Max (Vsup)

3.6V

Supply Voltage-Min (Vsup)

1.7V

Interface

CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB

Memory Size

2MB

Oscillator Type

Internal

Number of I/O

168

RAM Size

512K x 8

Voltage - Supply (Vcc/Vdd)

1.7V~3.6V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

ARM® Cortex®-M7

Peripherals

Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

Program Memory Type

FLASH

Core Size

32-Bit

Program Memory Size

2MB 2M x 8

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG

Bit Size

Data Converter

A/D 24x12b; D/A 2x12b

Has ADC

YES

DMA Channels

YES

PWM Channels

YES

DAC Channels

YES

Address Bus Width

ROM (words)

2097152

Core Architecture

ARM

On Chip Program ROM Width

External Data Bus Width

Length

13mm

Height Seated (Max)

1.1mm

Width

13mm

REACH SVHC

No SVHC

RoHS Status

ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$17.90000	$17.9
10	$16.45100	$164.51
160	$13.89413	$2223.0608
640	$12.35980	$7910.272

Description

The STM32F769NIH6 is built around the high-performance Arm? Cortex?-M7 32-bit RISC CPU, which runs at up to 216 MHz. A floating-point unit (FPU) in the Cortex?-M7 core supports Arm? double-precision and single-precision data-processing instructions and data formats. It also includes a memory protection unit (MPU) and a full set of DSP commands to improve application security.

The STM32F769NIH6 device includes a high-speed embedded memory with up to 2 Mbytes of Flash memory, 512 Kbytes of SRAM (including 128 Kbytes of Data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in low-power modes, with a large number of upgraded I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix, and a multi-layer AXI interface that supports internal and external memory access.

Features

? Core: Arm? 32-bit Cortex?-M7 CPU with DPFPU, ART Accelerator? and L1-cache: 16 Kbytes I/D cache, allowing 0-wait state execution from embedded Flash and external memories, up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions.

? Memories

– Up to 2 Mbytes of Flash memory organized into two banks allowing read-while-write

– SRAM: 512 Kbytes (including 128 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM

– Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories

? Dual mode Quad-SPI

? 8- to 14-bit camera interface up to 54 Mbyte/s

? True random number generator

? CRC calculation unit

? RTC: subsecond accuracy, hardware calendar

? 96-bit unique ID

Applications

? Home audio appliances

? Mobile applications, Internet of Things

? Wearable devices: smartwatches

? Industrial applications: PLC, inverters, circuit breakers

? Printers, and scanners

? Alarm systems, video intercom, and HVAC

? Motor drive and application control

? Medical equipment