ARM® Cortex®-A7 Microprocessor STM32MP1 Series 354-LFBGA
SOT-23
STM32MP157DAB1 Datasheet
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In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Package / Case
354-LFBGA
Operating Temperature
-20°C~105°C TJ
Series
STM32MP1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Speed
209MHz, 800MHz
Core Processor
ARM® Cortex®-A7
Voltage - I/O
2.5V 3.3V
Ethernet
10/100Mbps (1)
Number of Cores/Bus Width
2 Core 32-Bit
Graphics Acceleration
Yes
RAM Controllers
DDR3, DDR3L, LPDDR2, LPDDR3
USB
USB 2.0 (2), USB 2.0 OTG+ PHY (3)
Additional Interfaces
CAN, Ethernet, I2C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
Co-Processors/DSP
ARM® Cortex®-M4
Security Features
ARM TZ
Display & Interface Controllers
HDMI, LCD
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$27.45000
$27.45
500
$27.1755
$13587.75
1000
$26.901
$26901
1500
$26.6265
$39939.75
2000
$26.352
$52704
2500
$26.0775
$65193.75
STM32MP157DAB1 Product Details
STM32MP157DAB1 Description
A high-performance dual-core ARM Cortex-A7 and Cortex-M4 processor-based system-on-chip (SoC) from STMicroelectronics, the STM32MP157DAB1, is intended for a variety of industrial and consumer applications. It is a member of the STM32 MPU (microprocessor unit) series and is constructed using a 28nm FD-SOI (Fully Depleted Silicon On Insulator) process technology, which has superior reliability and lower power requirements than bulk CMOS.
STM32MP157DAB1 Features
Supports up to 1GB of DDR3L or LPDDR2 memory.
Includes various communication interfaces such as USB, Ethernet, CAN, and HDMI.
Wide range of peripherals including timers, ADCs, PWM controllers, and touch controllers.
Integrated 3D graphics processing unit (GPU) that supports OpenGL ES 2.0 and OpenVG 1.1.
Integrated security features such as secure boot, cryptographic acceleration, and tamper detection.
Dual-core ARM Cortex-A7 processor running up to 650 MHz and a Cortex-M4 core running at 209 MHz.
Designed for use in industrial control systems, human-machine interfaces, home automation, medical devices, and gaming consoles.
Built on a 28nm FD-SOI (Fully Depleted Silicon On Insulator) process technology for lower power consumption and higher reliability.