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S9693E-12

  • S9693E-12 - 2-Row Header, Breakaway Solder Phosphor Bronze Bulk Through Hole Tin Liquid Crystal Polymer (LCP) 24-Position Board to Board or Cable 0.100 2.54mm Height
  • S9693E-12 - 2-Row Header, Breakaway Solder Phosphor Bronze Bulk Through Hole Tin Liquid Crystal Polymer (LCP) 24-Position Board to Board or Cable 0.100 2.54mm Height

S9693E-12

S9693E-12

Sullins Connector Solutions

2-Row Header, Breakaway Solder Phosphor Bronze Bulk Through Hole Tin Liquid Crystal Polymer (LCP) 24-Position Board to Board or Cable 0.100 2.54mm Height

SOT-23

S9693E-12 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialPhosphor Bronze
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature-65°C~125°C
PackagingBulk
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Breakaway
Number of Positions 24
Number of Rows 2
Fastening TypePush-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Current Rating (Amps) 3A
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 3.05mm
Shrouding Unshrouded
Contact Length - Mating 0.230 5.84mm
Overall Contact Length 0.450 11.43mm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:3653 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.66000$1.66
10$1.50500$15.05
25$1.41320$35.33
50$1.35160$67.58
100$1.29020$129.02
250$1.16736$291.84
500$1.07520$537.6

S9693E-12 Product Details

S9693E-12 Overview


This product is packaged in a Header, Breakaway box.Through Hole indicates that the device is mounted.An Bulk case is utilized for packaging the product.Operating temperature is set to -65°C~125°C.

S9693E-12 Features




S9693E-12 Applications


There are a lot of Sullins Connector Solutions
S9693E-12 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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