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HV301LG

HV301LG

HV301LG

Supertex

1 Hot Swap Controllers SOIC 1

SOT-23

HV301LG Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 8
Weight 540.001716mg
JESD-609 Code e0
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 125°C
Min Operating Temperature -40°C
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Depth 3.9mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 8
Qualification Status Not Qualified
Operating Supply Voltage 59.85V
Temperature Grade INDUSTRIAL
Number of Channels 1
Max Supply Voltage 90V
Min Supply Voltage 10V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Operating Supply Current 700μA
Adjustable Threshold YES
Supply Current-Max (Isup) 0.7mA
Neg Supply Voltage-Nom (Vsup) -48V
Length 4.9mm
RoHS Status Non-RoHS Compliant
HV301LG Product Details

HV301LG Overview


In the SOIC package you will find it.Channel 1 is currently available.The 8 terminations total to three.Device DUAL is located at the terminal position.The device consists of a total of 8 pins.During operation, 8 pins are used.As you can see, it is positioned in the direction of Surface Mount.For stable operation, the maximum operating temperature should be 125°C°C.At a minimum working temperature of -40°C degrees Celsius, it maintains its reliability.As you can see in this example, the gadget uses an analog IC called POWER SUPPLY SUPPORT CIRCUIT.The maximum supply current it requires to operate is 0.7mA.An input voltage of 90VV is the maximum it can handle.Using a low supply voltage, such as 10VV, will be feasible.Hot Swap is 700μA which is the operative supply current.

HV301LG Features


The terminal position of 8


HV301LG Applications


There are a lot of Supertex
HV301LG hot swap controllers applications.


  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems
  • Redundant negative voltage supplies
  • Central office switching systems

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