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GBU2507 D2

GBU2507 D2

GBU2507 D2

Taiwan Semiconductor Corporation

GBU2507 D2 datasheet pdf and Diodes - Bridge Rectifiers product details from Taiwan Semiconductor Corporation stock available on our website

SOT-23

GBU2507 D2 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 5 Weeks
Mounting Type Through Hole
Package / Case 4-SIP, GBU
Surface Mount NO
Diode Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tube
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 4
Additional Feature UL RECOGNIZED
Technology Standard
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PSFM-T4
Number of Elements 4
Configuration BRIDGE, 4 ELEMENTS
Diode Type Single Phase
Current - Reverse Leakage @ Vr 10μA @ 1000V
Voltage - Forward (Vf) (Max) @ If 1.2V @ 25A
Output Current-Max 25A
Current - Average Rectified (Io) 25A
Number of Phases 1
Non-rep Pk Forward Current-Max 300A
Voltage - Peak Reverse (Max) 1kV
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2.822532 $2.822532
10 $2.662765 $26.62765
100 $2.512043 $251.2043
500 $2.369852 $1184.926
1000 $2.235709 $2235.709
GBU2507 D2 Product Details

GBU2507 D2 Overview


A 4-SIP, GBU package electronic component is basically a type of electronic component.Keeping it at -55°C~150°C TJ ensures its normal operation.The maximum output voltage of 25A can be supported by it.

GBU2507 D2 Features


4-SIP, GBU package
operating at a temperature of -55°C~150°C TJ
the maximum output voltage of 25A

GBU2507 D2 Applications


There are a lot of Taiwan Semiconductor Corporation GBU2507 D2 applications of bridge rectifiers.

  • Supplies for DC power equipment
  • Extremely robust construction
  • Low thermal resistance
  • Solid state SCR based switches
  • Crowbar systems for motor drives
  • High temperature and rectifiers
  • Electrically isolated aluminum case
  • Aviation – Standby power distribution, resistive heating
  • Fuse-in-glass diodes design
  • Controlled avalanche characteristics

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