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UR8KB60 C2G

UR8KB60 C2G

UR8KB60 C2G

Taiwan Semiconductor Corporation

UR8KB60 C2G datasheet pdf and Diodes - Bridge Rectifiers product details from Taiwan Semiconductor Corporation stock available on our website

SOT-23

UR8KB60 C2G Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 5 Weeks
Mounting Type Through Hole
Package / Case 4-ESIP
Surface Mount NO
Diode Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tube
Published 2016
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 4
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature UL RECOGNIZED
Technology Standard
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PSFM-T4
Number of Elements 4
Configuration BRIDGE, 4 ELEMENTS
Diode Type Single Phase
Current - Reverse Leakage @ Vr 10μA @ 600V
Voltage - Forward (Vf) (Max) @ If 1.1V @ 8A
Case Connection ISOLATED
Output Current-Max 8A
Current - Average Rectified (Io) 8A
Number of Phases 1
Non-rep Pk Forward Current-Max 170A
Voltage - Peak Reverse (Max) 600V
RoHS Status ROHS3 Compliant
UR8KB60 C2G Product Details

UR8KB60 C2G Overview


A 4-ESIP package electronic component is basically a type of electronic component.Keeping the temperature at -55°C~150°C TJ ensures normal operation.In terms of output voltage, 8A is the maximum voltage that can be supported.

UR8KB60 C2G Features


4-ESIP package
operating at a temperature of -55°C~150°C TJ
the maximum output voltage of 8A

UR8KB60 C2G Applications


There are a lot of Taiwan Semiconductor Corporation UR8KB60 C2G applications of bridge rectifiers.

  • Working peak reverse voltages 200 to 1 ,000 volts
  • Electroplating systems – Input SCRs and output rectifiers
  • SCR power bridges for solid state starters
  • Rectifier for induction heating
  • SCR and diode based input rectifiers
  • Uninterruptible power supplies – SCR transfer switches and input rectifiers
  • Welding equipment
  • Solid state SCR based switches
  • Controlled avalanche characteristics
  • Fuse-in-glass diodes design

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