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CGA4J1X7R1V475K125AE

  • CGA4J1X7R1V475K125AE
  • CGA4J1X7R1V475K125AE

CGA4J1X7R1V475K125AE

CGA4J1X7R1V475K125AE

TDK Corporation

CGA4J1X7R1V475K125AE datasheet pdf and Ceramic Capacitors product details from TDK Corporation stock available on our website

SOT-23

CGA4J1X7R1V475K125AE Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Lifecycle Status PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount, MLCC
Package / Case 0805 (2012 Metric)
Terminal Shape WRAPAROUND
Dielectric Material CERAMIC
Weight 5.499807mg
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Published 2014
Series CGA
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
Tolerance ±10%
JESD-609 Code e3
Feature Soft Termination
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
Temperature Coefficient X7R
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Applications Automotive, Boardflex Sensitive
Capacitance 4.7μF
Voltage - Rated DC 35V
Packing Method TR, 7 INCH
Case Code (Metric) 2012
Case Code (Imperial) 0805
Capacitor Type CERAMIC CAPACITOR
Temperature Characteristics Code X7R
Multilayer Yes
Height 1.25mm
Length 2mm
Thickness (Max) 0.059 1.50mm
Thickness 1.4986mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Ratings AEC-Q200
Pricing & Ordering
Quantity Unit Price Ext. Price
2,000 $0.20240 $0.4048
4,000 $0.18975 $0.759
CGA4J1X7R1V475K125AE Product Details

CGA4J1X7R1V475K125AE Description


The CGA4J1X7R1V475K125AE is a TDK multilayer ceramic chip capacitor.



CGA4J1X7R1V475K125AE Features


  • Higher mechanical endurance is realized by flexible resin layers.

  • X8R type which a maximum temperature is up to 150°C is applicable.

  • C0G temperature characteristic which has an excellent stable temperature and DC-bias characteristics are applicable.

  • AEC-Q200 compliant.



CGA4J1X7R1V475K125AE Applications


  • Fail-safe design in battery line.

  • Prevention of ceramic body cracks by board bending.

  • Prevention of solder cracks by thermal shock.

  • The set has a high probability of fall such as keyless entry and smart-key


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