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B43890A4106M000

B43890A4106M000

B43890A4106M000

TDK Electronics Inc.

Cap Aluminum Lytic 10uF 350V 20% (10 X 20mm) Radial 5mm 26.5 Ohm 318mA 10000h 105C Bulk

SOT-23

B43890A4106M000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 24 Weeks
Lifecycle Status PRODUCTION (Last Updated: 2 months ago)
Mounting Type Through Hole
Package / Case Radial, Can
Operating Temperature-25°C~105°C
PackagingBulk
Series B43890
Size / Dimension 0.394Dia 10.00mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature105°C
Min Operating Temperature -25°C
Applications General Purpose
Voltage - Rated 350V
Capacitance 10μF
Lead Pitch 5mm
ESR (Equivalent Series Resistance) 26.5Ohm
Lead Spacing0.197 5.00mm
Lead Diameter 600 μm
Lifetime @ Temp 12000 Hrs @ 105°C
Ripple Current318mA
Polarization Polar
Life (Hours) 10000 hours
Ripple Current @ High Frequency 318mA @ 100kHz
Height Seated (Max) 0.866 22.00mm
RoHS StatusROHS3 Compliant
In-Stock:17263 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About B43890A4106M000

The B43890A4106M000 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Cap Aluminum Lytic 10uF 350V 20% (10 X 20mm) Radial 5mm 26.5 Ohm 318mA 10000h 105C Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B43890A4106M000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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