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B66455G0000X608

B66455G0000X608

B66455G0000X608

TDK Electronics Inc.

ELP22/6/16-PC200

SOT-23

B66455G0000X608 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Supplier Device Package ELP 22 x 6 x 16
Material PC200
Published 2017
Series B66455
Tolerance ±25%
Part StatusActive
Finish Uncoated
Core Type ELP
Gap Ungapped
Effective Area (Ae) mm2 78.3
Effective Length (le) mm 32.5
Effective Magnetic Volume (Ve) mm3 2540
Core Factor (ΣI/A) mm1 0.41
Initial Permeability (μi) 800
Minimum Core Cross Section (Amin) mm2 77.9
Inductance Factor (Al) 2100nH
Effective Permeability (μe) 640
Height 5.70mm
Length 21.80mm
Width 15.80mm
RoHS StatusROHS3 Compliant
In-Stock:2775 items

Pricing & Ordering

QuantityUnit PriceExt. Price
600$0.69000$414

About B66455G0000X608

The B66455G0000X608 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features ELP22/6/16-PC200.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B66455G0000X608, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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