B82422A3100J100

new-10%

Manufacturer part number:B82422A3100J100

Manufacturer:TDK Electronics Inc.

Description:Ind Chip Molded Wirewound 10nH 5% 10MHz 20Q-Factor Ceramic 750mA 1210 Blister T/R

Case Package:SOT-23

Datasheet:B82422A3100J100 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Mounting Type	Surface Mount
Package / Case	2-SMD, J-Lead
Supplier Device Package	1210 (3225 Metric)
Material - Core	Ceramic
Operating Temperature	-55°C~125°C
Packaging	Tape & Reel (TR)
Series	SIMID
Size / Dimension	0.126Lx0.098W 3.20mmx2.50mm
Tolerance	±5%
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Wirewound
Current Rating (Amps)	750mA
Shielding	Unshielded
Inductance	10nH
DC Resistance (DCR)	90mOhm Max
Frequency - Self Resonant	4GHz
Q @ Freq	20 @ 100MHz
Inductance Frequency - Test	10MHz
Height Seated (Max)	0.083 2.10mm
RoHS Status	ROHS3 Compliant
Ratings	AEC-Q200