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B82422A3120J100

B82422A3120J100

B82422A3120J100

TDK Electronics Inc.

Ind Chip Molded Wirewound 12nH 5% 10MHz 25Q-Factor Ceramic 700mA 1210 Blister T/R

SOT-23

B82422A3120J100 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 2-SMD, J-Lead
Supplier Device Package 1210 (3225 Metric)
Material - Core Ceramic
Operating Temperature-55°C~125°C
PackagingTape & Reel (TR)
Series SIMID
Size / Dimension 0.126Lx0.098W 3.20mmx2.50mm
Tolerance ±5%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Current Rating (Amps) 700mA
Shielding Unshielded
Inductance 12nH
DC Resistance (DCR) 100mOhm Max
Frequency - Self Resonant 3.5GHz
Q @ Freq 25 @ 100MHz
Inductance Frequency - Test 10MHz
Height Seated (Max) 0.083 2.10mm
RoHS StatusROHS3 Compliant
Ratings AEC-Q200
In-Stock:27031 items

Pricing & Ordering

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About B82422A3120J100

The B82422A3120J100 from TDK Electronics Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Ind Chip Molded Wirewound 12nH 5% 10MHz 25Q-Factor Ceramic 700mA 1210 Blister T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the B82422A3120J100, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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