B82422T3150J000

new-10%

Manufacturer part number:B82422T3150J000

Manufacturer:TDK Electronics Inc.

Description:Inductor GP Chip Molded Wirewound 15nH 5% 100MHz 19Q-Factor Ceramic 450mA 130mOhm DCR 1210 Blister T/R

Case Package:SOT-23

Datasheet:B82422T3150J000 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Mounting Type	Surface Mount
Package / Case	2-SMD, J-Lead
Supplier Device Package	1210 (3225 Metric)
Material - Core	Ceramic
Operating Temperature	-55°C~125°C
Packaging	Tape & Reel (TR)
Series	SIMID
Size / Dimension	0.126Lx0.098W 3.20mmx2.50mm
Tolerance	±5%
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Type	Wirewound
Current Rating (Amps)	450mA
Shielding	Unshielded
Inductance	15nH
DC Resistance (DCR)	130mOhm Max
Frequency - Self Resonant	3GHz
Q @ Freq	19 @ 100MHz
Inductance Frequency - Test	100MHz
Height Seated (Max)	0.083 2.10mm
RoHS Status	ROHS3 Compliant
Ratings	AEC-Q200