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B82422T3560J000

B82422T3560J000

B82422T3560J000

TDK Electronics Inc.

Inductor GP Chip Molded Wirewound 56nH 5% 100MHz 26Q-Factor Ceramic 450mA 210mOhm DCR 1210 Blister T/R

SOT-23

B82422T3560J000 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 2-SMD, J-Lead
Supplier Device Package 1210 (3225 Metric)
Material - Core Ceramic
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series SIMID
Size / Dimension 0.126Lx0.098W 3.20mmx2.50mm
Tolerance ±5%
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Current Rating (Amps) 450mA
Shielding Unshielded
Inductance 56nH
DC Resistance (DCR) 210mOhm Max
Frequency - Self Resonant 1.1GHz
Q @ Freq 26 @ 100MHz
Inductance Frequency - Test 100MHz
Height Seated (Max) 0.083 2.10mm
RoHS Status ROHS3 Compliant
Ratings AEC-Q200
Pricing & Ordering
Quantity Unit Price Ext. Price

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