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205166-4

205166-4

205166-4

TE Connectivity

205166-4 datasheet pdf and D-Sub, D-Shaped Connectors - Housings product details from TE Connectivity stock available on our website

SOT-23

205166-4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialNOT SPECIFIED
Mount Free Hanging
Shell Material Steel
Dielectric MaterialGlass
Housing Material Polyester
PackagingBulk
Pbfree Code yes
Connector Type Plug
Number of Positions 25
Max Operating Temperature60°C
Min Operating Temperature -20°C
Color Blue
Number of Rows 2
Gender Male
Contact Finish - Mating NOT SPECIFIED
MIL Conformance YES
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 25
Orientation Straight
Depth 16.36mm
Reach Compliance Code unknown
Shell Finish TIN
Empty Shell NO
Contact Style Crimp
ELV Compliant
Shell Size 3/B
Plating Copper, Tin
Hole Diameter 3.05 mm
Length 53.04mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:1120 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 205166-4

The 205166-4 from TE Connectivity is a high-performance microcontroller designed for a wide range of embedded applications. This component features 205166-4 datasheet pdf and D-Sub, D-Shaped Connectors - Housings product details from TE Connectivity stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 205166-4, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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