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TXR32AB00-2206BI

  • TXR32AB00-2206BI
  • TXR32AB00-2206BI

TXR32AB00-2206BI

TXR32AB00-2206BI

TE Connectivity Aerospace, Defense and Marine

TXR32AB00-2206BI datasheet pdf and Circular Connectors - Backshells and Cable Clamps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

TXR32AB00-2206BI Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 26 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Material Aluminum Alloy
Body Material Aluminium
Packaging Bulk
Published 2005
Series TXR
Feature Tinel Lock
Part Status Active
Type Backshell, Heat Shrink Adapter
Max Operating Temperature 175°C
Min Operating Temperature -65°C
Color Olive Drab
Contact Finish - Mating NOT SPECIFIED
Shielding Shielded
Reach Compliance Code not_compliant
Military Standard MIL-DTL-22992
Shell Size - Insert 22
ELV Non-Compliant
Plating Cadmium
Thread Size 1 3/8-18 UNEF
Wire/Cable Diameter 7.6 mm
Includes 6 pcs - 1 Backshell, 1 Braid, 1 O-Ring, 2 Screws, 1 Tinel Ring
Cable Exit 180°
Diameter - Outside 1.689 (42.90mm)
RoHS Status Non-RoHS Compliant
Lead Free Not Applicable
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $330.693270 $330.69327
10 $311.974782 $3119.74782
100 $294.315832 $29431.5832
500 $277.656446 $138828.223
1000 $261.940043 $261940.043
TXR32AB00-2206BI Product Details

TXR32AB00-2206BI Overview


We pack the product in a Bulk case.The product is a member of the TXR Series.It's best to use it when the temperature is below 175°C.There is a minimum temperature requirement of [0°C] for this device.In many ways, its Tinel Lock feature makes it more powerful.Several benefits are shared by this part with other Backshell, Heat Shrink Adapter products.

TXR32AB00-2206BI Features


TXR series

TXR32AB00-2206BI Applications


There are a lot of TE Connectivity Aerospace, Defense and Marine TXR32AB00-2206BI Circular Connectors applications.

  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Embedded systems
  • Control panels
  • Refrigeration control
  • Variable speed/frequency drivers
  • Instrumentation
  • Communication
  • Datacom

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