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44A0UT82116996CS2275

44A0UT82116996CS2275

44A0UT82116996CS2275

TECONNECTIVITY

44A0UT82116996CS2275 datasheet pdf and Card Guides product details from TECONNECTIVITY stock available on our website

SOT-23

44A0UT82116996CS2275 Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 7 months ago)
Lifecycle Status 21 Weeks
Mount Flanges
Mounting Type Through Hole
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 4
Operating Temperature -40°C ~ 125°C
Packaging Box
Pbfree Code -
Part Status -
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 9
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Regulators
Voltage - Supply 4V ~ 30V
Base Part Number Uhf Djdkoa
Output Voltage 36 V
Output Type Transistor Driver
Interface -
Termination Type SOLDER
Operating Supply Current 80 μA
Nominal Supply Current 700 μA
Output Current 70 mA
Max Supply Current 800 μA
Slew Rate 0.1V/μs
Architecture -
Amplifier Type General Purpose
In-Stock:4942 items

About 44A0UT82116996CS2275

The 44A0UT82116996CS2275 from TECONNECTIVITY is a high-performance microcontroller designed for a wide range of embedded applications. This component features 44A0UT82116996CS2275 datasheet pdf and Card Guides product details from TECONNECTIVITY stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 44A0UT82116996CS2275, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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