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H4P5UT1R1DCA

H4P5UT1R1DCA

H4P5UT1R1DCA

TECONNECTIVITYPASSIVEPRODUCT

H4P5UT1R1DCA datasheet pdf and Card Guides product details from TECONNECTIVITYPASSIVEPRODUCT stock available on our website

SOT-23

H4P5UT1R1DCA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 6 days ago)
Lifecycle Status 10 Weeks
Mount Surface Mount
Mounting Type Press Fit, Through Hole
Package / Case TQFP
Number of Pins 4
Operating Temperature -40°C ~ 125°C
Packaging Tape & Reel (TR)
Pbfree Code -
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 4
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors/Transducers
Voltage - Supply -
Base Part Number Ecemy Xrerob
Output Voltage 52 V
Output Type N-Channel
Interface I2C, SPI
Termination Type -
Operating Supply Current 1.5 mA
Nominal Supply Current 1 mA
Output Current 30 mA
Max Supply Current 700 μA
Slew Rate 0.6V/μs
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:3039 items

About H4P5UT1R1DCA

The H4P5UT1R1DCA from TECONNECTIVITYPASSIVEPRODUCT is a high-performance microcontroller designed for a wide range of embedded applications. This component features H4P5UT1R1DCA datasheet pdf and Card Guides product details from TECONNECTIVITYPASSIVEPRODUCT stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H4P5UT1R1DCA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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