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EVS32M16T-5 BI

EVS32M16T-5 BI

EVS32M16T-5 BI

Teledyne e2v

EVS32M16T-5 BI datasheet pdf and Memory Cards product details from Teledyne e2v stock available on our website

SOT-23

EVS32M16T-5 BI Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
HTS 8542.32.00.41
Module DRAM Module
Module Density 1Gbit
Number of Chip per Module 2
Chip Density (bit) 512M
Data Bus Width (bit) 16
Maximum Clock Rate (MHz) 167
Chip Configuration 32Mx16
Chip Package Type 66TSOP-II
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5
Maximum Operating Supply Voltage (V) 2.7
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
ECC Support No
Number of Chip Banks 4
CAS Latency 3
SPD EEPROM Support No
Supplier Package TSOP-II
Mounting Surface Mount
Package Height 1.8(Min)
Package Length 22.62(Max)
PCB changed 66
Pin Count 66
Organization 64Mx16
PLL No
Self Refresh Yes
RoHS Status Supplier Unconfirmed

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