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DAC38RF93IAAVR

DAC38RF93IAAVR

DAC38RF93IAAVR

Texas Instruments

DAC Surface Mount 1.94mm μm 10mm mm

SOT-23

DAC38RF93IAAVR Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Mounting Type Surface Mount
Package / Case 144-FBGA, FCBGA
Surface Mount YES
Number of Pins 144
Packaging Tape & Reel (TR)
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Base Part Number DAC38RF93
Temperature Grade INDUSTRIAL
Number of Bits 14
Supply Current-Max 1758mA
Converter Type D/A CONVERTER
Sampling Rate 9000 MHz
Settling Time 0.001 µs
Negative Supply Voltage-Nom -1.8V
Input Format PARALLEL, WORD
Number of DAC Channels 2
Analog Output Voltage-Min 1.3V
Height 1.94mm
Length 10mm
Width 10mm
Thickness 1.45mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1,000 $108.84500 $108.845
DAC38RF93IAAVR Product Details

DAC38RF93IAAVR Overview


A 144-FBGA, FCBGA package contains it, and it is available for download. Power is provided by a 1.8V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A model of this FPGA is contained in Tape & Reel (TR) for the purpose of saving space. In total, there are a total of 144 terminations on it. For related parts, use its base part number DAC38RF93. This cable has 144 pins and is designed to connect to a computer. A maximum operating temperature of 85°C can be reached by this module. Over -40°C should be the operating temperature.

DAC38RF93IAAVR Features


144-FBGA, FCBGA package
144 pins


DAC38RF93IAAVR Applications


There are a lot of Texas Instruments
DAC38RF93IAAVR Digital to Analog Converters (DAC) applications.


  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation
  • Automatic Test Equipment

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