DBB03IPM datasheet pdf and RF Misc ICs and Modules product details from Texas Instruments stock available on our website
SOT-23
DBB03IPM Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
64-LQFP
Number of Pins
64
Weight
342.689036mg
Packaging
Tray
JESD-609 Code
e4
Pbfree Code
no
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Base Part Number
DBB03
Function
Baseband ASIC for Dolphin Chipset
Secondary Attributes
Baseband ASIC for Dolphin Chipset
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
DBB03IPM Product Details
DBB03IPM Overview
RF ICs with enhanced 64-LQFP packages are excellent with common characteristics.The Tray package houses this RF modulator.A Surface Mount-type PCB or development board can be used to place this RF modulator.An enhanced power dissipation control RF module featuring 64 pins.It is important that the operating RF switch IC's temperature is below 85°C.This RF switch IC should not operate at a temperature lower than -40°C.
DBB03IPM Features
64-LQFP package Tray 64 pins
DBB03IPM Applications
There are a lot of Texas Instruments DBB03IPM RF Misc ICs and Modules applications.