DLP9000FLS Overview

Integrated circuit is enclosed in a package 355-BCLGA.A package named Tray contains integrated circuit.Mounting is done using the Surface Mount method.There are numerous integrated circuits that make use of this type of Digital Micromirror Device (DMD).Search the DLP9000 family for similar integrated circuit systems.It is appropriate for the ICs to be applied in 3D, Medical Imaging.ICs solutions terminations total 355.A ICs applications with 355 pins is available.The integrated circuit chip's temperature should not be higher than 70°C when you use it.Operating temperatures should not be lower than 0°C.Ideally, Vsup should not be less than 3V.Vsup should not exceed 3.6V for this application specific integrated circuit.

DLP9000FLS Features

Applications : 3D, Medical Imaging

DLP9000FLS Applications

There are a lot of Texas Instruments DLP9000FLS Specialized ICs applications.

• Secure Download and Boot
• μP Switch Interfacing
• All AC-DC converters with X capacitors of 100 nF up to 6 mF
• Ecosystem Control
• Appliances requiring ErP Lot 6 compliance
• Secure Management of Limited Use Consumables
• Industrial Networks
• Lossless generation of zero crossing signal
• Message Security
• Cell Phones