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DSV14196WM

DSV14196WM

DSV14196WM

Texas Instruments

DSV14196 Receivers5/3 Drivers/Receivers

SOT-23

DSV14196WM Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Operating Temperature 0°C~70°C
Packaging Tube
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Transceiver
HTS Code 8542.39.00.01
Voltage - Supply 3V~3.6V
Base Part Number DSV14196
Pin Count 20
Output Current 18mA
Data Rate 230.4Kbps
Protocol RS232
Number of Drivers/Receivers 5/3
Duplex Full
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
DSV14196WM Product Details

DSV14196WM Overview


Due to the enhanced 20-SOIC (0.295, 7.50mm Width) package, this driver IC is excellent for driving common LEDs.The receiver is packaged in a Tube package.It has proved to be a valuable component for a variety of applications since it is a Transceiver can transceiver.PCB or development board with Surface Mount-type connectors can accommodate this wide receiver.A differential driver like this uses 3V~3.6V of power.At any given time, there can be up to 5/3 eligible receivers/drivers for this electronic part.This ic receiver has been primarily designed for applications where the operating temperature is 0°C~70°C.This transceiver is packaged with 20 market standard pinoutsYou can search with DSV14196 to get more variants of this part, since it identifies the product type, temperature, package, etc.Optical transceiver package size is greatly reduced due to downsizing of the ICs and high-density Surface Mount mounting technologies.With the help of this bluetooth transceiver, you will be able to provide an output current of 18mA.

DSV14196WM Features


Tube package
20 pin count

DSV14196WM Applications


There are a lot of Texas Instruments DSV14196WM Drivers/Receivers/Transceivers applications.

  • Cable network front end
  • Switches
  • Wireless network systems
  • Wireless interactive experience
  • Broadcast application
  • Bridges
  • Remote controls
  • Thermal management
  • Laser diode bonding
  • Cell phones

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