SN65HVD24DR Overview

This LED driver IC features an enhanced 8-SOIC (0.154, 3.90mm Width) package for driving common LEDs.In this package, the receiver is mounted in the Tape & Reel (TR) format.The Transceiver can transceiver technology has enabled this part to power many solutions for a variety of uses.A Surface Mount-type PCB or development board can be used to place this wide receiver.In terms of power supply, this differential driver utilizes 4.5V~5.5V.It is possible to have up to 1/1 receivers/drivers in use simultaneously with this electronic part.IC receiver is designed for applications with a temperature of -40°C~85°C.Driver ICs in this category can operate efficiently with a supply voltage range of 5V.This integrated circuit has 8 terminations designed for driving and receiving signals from data.This transceiver is packaged with 8 market standard pinoutsWith the part number 65HVD24 identifying the product type, temperature, package, etc., you can search with it to see more variants.An enhanced power dissipation control is provided by this 8-pin driver IC.A dramatic reduction in package size is achieved through optical transceiver downsizing and high-density Surface Mount mounting technologies.In terms of resolution, this ic receiver was capable of providing a 1-bit resolution.This receiver is typically specified with a resolution of 1 bits. As mentioned above, the transceiver module is designed to operate from an input voltage supply of 5V.This rf transceiver module can be grouped into a subcategory named Line Driver or Receivers.There is one driver IC that is designed to operate from a 5V power supply, and only one driver IC in total.In total, there are 1 transceivers implemented by this module isolated transceiver.

SN65HVD24DR Features

Tape & Reel (TR) package
8 pin count
8 pins
5V power supply

SN65HVD24DR Applications

There are a lot of Texas Instruments SN65HVD24DR Drivers/Receivers/Transceivers applications.

• transmission relay
• Telecom applications
• Cable network front end
• Metro access rings
• Thermal management
• Laser diode bonding
• Precision engineering measurement
• Wireless security systems
• Data center
• LAN, SAN, WAN (local, storage, work area networks)