SN65LVDS31PW Overview

Designed for common LEDs, this driver IC features an enhanced 16-TSSOP (0.173, 4.40mm Width) package.Tube package is used to mount this receiver.Since this part is a Driver can transceiver, a number of solutions have been able to utiliDrivere it for various purposes.On any Surface Mount-type PCB or development board, this wide receiver can be placed.With respect to the power supply, this differential driver uses 3V~3.6V.There can be up to 4/0 eligible receivers/drivers on the field at the same time with this electronic part.Applications with operating temperatures of -40°C~85°C have been designed primarily for this ic receiver.An output voltage range of 3.3V is sufficient to run this line driver ic efficiently.Integrated into this wide receiver are 16 terminations that are used for driving and receiving signals from data.The transceiver is packaged with 16 market standard pinouts so that it can be easily used.With the part number 65LVDS31 identifying the product type, temperature, package, etc., you can search with it to see more variants.A 16-pin driver IC with enhanced power dissipation control is featured here.A combination of optical transceiver downsizing and high-density Surface Mount mounting reduces the package size dramatically.It provided a 4-bit resolution capability with this ic receiver.There is a 3.3V input voltage supply that can be used to operate this transceiver module.There are 4 receivers inside.Input voltage is set to a value of 35mA, and this integrating circuit is capable of driving LEDs with that voltage.A power-saving technique is used in this integrating circuit, whintegrating circuith belongs to the 65LVDS series.

SN65LVDS31PW Features

Tube package
16 pin count
16 pins
65LVDS series

SN65LVDS31PW Applications

There are a lot of Texas Instruments SN65LVDS31PW Drivers/Receivers/Transceivers applications.

• Transmission stations
• Notebook
• Cable network front end
• IPTV front end
• IP cameras
• Clock radio
• Fiber-to-the-desktop
• Thermal management
• Car radio
• Structural bonding