TMDXEVM6657L Description

The TMDXEVM6657L Lite Evaluation Modules (EVM), which are simple to use and reasonably priced development tools, assist designers in getting up and running with designs utilizing the C6657, C6655, or C6654 family of DSPs. Customers can employ this AMC form factor card in different systems because of the EVMs' on-board single C6657 CPU and wide range of connectivity choices. They can also be used independently. The Code Composer StudioTM Integrated Development Environment version 5 (CCS v5), the Multicore Software Development Kit (MCSDK), the Board Support Package (BSP), the Chip Support Library (CSL), the Power On Self Test (POST), the Network Development Kit (NDK), the SYSBIOS, and the Out of Box (OOB) Demonstration software are all included in the software that comes with the 6657L EVM. The XDS100 onboard emulation capability is a feature of the TMDSEVM6657L EVM. Moreover, a third-party emulator can be used by using the JTAG emulation header. TMDXEVM6657LE DETAILS: The TMS320C6657 Lightweight Evaluation Modules (EVM), which are simple to use and reasonably priced development tools, assist designers in getting up and running with designs utilizing the C6657, C6655, or C6654 family of DSPs. Customers can employ this AMC form factor card in different systems because to the EVMs' on-board single C6657 CPU and wide range of connectivity choices. They can also be used independently. The Code Composer StudioTM Integrated Development Environment version 5 (CCS v5), the Multicore Software Development Kit (MCSDK), the Board Support Package (BSP), the Chip Support Library (CSL), the Power On Self Test (POST), the Network Development Kit (NDK), the SYSBIOS, and the Out of Box (OOB) Demonstration software are all included in the software that comes with the 6657L EVM. The XDS560V2 onboard emulation capability is a feature of the TMDSEVM6657LE EVM. The TI 60-pin JTAG emulation header is used by the XDS560 mezzanine card that is provided.

TMDXEVM6657L Features

• RS232 Serial interface on 3-Pin header or UART over mini-USB connector

• UPP, Timer, SPI, McBSP, UART interfaces on 80-pin expansion header

• On-Board XDS100 type Emulation using USB 2.0 interface

• TI 60-Pin JTAG header to support External Emulator

• High Speed Integrated XDS560v2 Mezzanine Emulator

• High Speed Integrated XDS200 Mezzanine Emulator

• Module Management Controller (MMC) for Intelligent Platform Management Interface (IPMI)

• Powered by DC power-brick adaptor (12V/2.5A) or AMC Carrier back-plane

• PICMG® AMC.0 R2.0 single width, full height AdvancedMC module

• Texas Instruments' fixed point DSP - TMS320C6657

• 512 Mbytes of DDR3 Memory (up to 1024Mbytes supported)

• 128 Mbytes of NAND Flash

• 16 Mbytes of NOR Flash

• One Gigabit Ethernet port supporting 10/100/1000 Mbps data rate – switched between RJ-45 connector and AMC fingers

• 170 pin B+ style AMC Interface

• High performance connector for HyperLink

• 128 kbytes I2C EEPROM for booting

• 4 User Indication LEDs, 4 Software Controlled LEDs and 3 User DIP Switches

TMDXEVM6657L Applications

• Audio signal

• Speech processing

• RADAR

• Seismology

• Audio

• SONAR

• Voice recognition

• Some financial signals. For example, digital signal processing is used for speech compression for mobile phones, as well as speech transmission for mobile phones.