TMS5704357BGWTEP Description

The TMS570LC4357-EP is part of the Hercules TMS570 line of high-performance ARM? Cortex?-R-based MCUs for automotive applications. To aid in the creation of ISO 26262 and IEC 61508 functional safety applications, comprehensive documentation, tools, and software are provided. With the Hercules TMS570LC43x LaunchPad Development Kit, you may start evaluating right now. On-chip diagnostic features include dual CPUs in lockstep, Built-In Self-Test (BIST) logic for the CPU, the N2HET coprocessors, and for-chip SRAMs, as well as ECC protection on the L1 caches, L2 flash, and SRAM memories on the TMS570LC4357-EP device. On peripheral memory, the device additionally offers ECC or parity protection and loopback functionality on peripheral I/Os.

The TMS570LC4357-EP device incorporates two ARM Cortex-R5F floating-point CPUs that operate in lockstep and provide an efficient 1.66 DMIPS/MHz, with a maximum speed of 300 MHz and 498 DMIPS. The device supports the big-endian [BE32] format.

TMS5704357BGWTEP Features

• Three On-Die Temperature Sensors

• Up to 145 Pins Available for General-Purpose I/O (GPIO)

• 16 Dedicated GPIO Pins With External Interrupt Capability Multiple Communication Interfaces

• Separate Nonmodulating PLL

• IEEE 1149.1 JTAG, Boundary Scan, and ARM CoreSight? Components

TMS5704357BGWTEP Applications

• Braking Systems (Antilock Brake Systems and

• Electronic Stability Control)

• Electric Power Steering (EPS)

• HEV and EV Inverter Systems

• Battery-Management Systems

• Active Driver Assistance Systems

• Aerospace and Avionics

• Railway Communications

• Off-road Vehicles