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TMX320C6211GFN

TMX320C6211GFN

TMX320C6211GFN

Texas Instruments

1.27mm 1.83.3V CPLD 1.8V BGA

SOT-23

TMX320C6211GFN Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case BGA
Surface MountYES
Pbfree Code no
Number of Terminations 256
Additional FeatureALSO REQUIRES 3.3V I/O SUPPLY
Subcategory Digital Signal Processors
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.8V
Terminal Pitch1.27mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count256
Qualification StatusNot Qualified
Operating Temperature (Max) 90°C
Supply Voltage-Max (Vsup) 1.89V
Power Supplies1.83.3V
Temperature GradeOTHER
Supply Voltage-Min (Vsup) 1.71V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Bit Size 32
Address Bus Width22
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
RAM (words) 65536
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Length 27mm
Height Seated (Max) 2.32mm
Width 27mm
RoHS StatusNon-RoHS Compliant
In-Stock:1664 items

TMX320C6211GFN Product Details

TMX320C6211GFN Overview


It is a kind of electronic component available in the BGA package.There are 256 terminations for its uses.It operates with the supply voltage of 1.8V.There are 256 component pins.Based on its specific characteristics, this device can be classified into the subcategory of Digital Signal Processors.It is supplied with 1.83.3V electric power.More additional features of ALSO REQUIRES 3.3V I/O SUPPLY can also be provided by this electronic part.It employs DIGITAL SIGNAL PROCESSOR, OTHER as its uPs/uCs/Peripheral ICs type.The maximum operating temperature should be kept at 90°C.

TMX320C6211GFN Features


Supplied in the BGA package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics


TMX320C6211GFN Applications


There are a lot of Texas Instruments
TMX320C6211GFN DSP applications.


  • Audio signal
  • Speech processing
  • Radar
  • Seismology
  • Audio
  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation

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