TMX320C6670CYP

Name	Value
Type	Parameter
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	841-BFBGA, FCBGA
Number of Pins	841
Operating Temperature	0°C~100°C TC
Packaging	Tube
Series	TMS320C66x
Pbfree Code	no
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	841
Type	Fixed/Floating Point
Subcategory	Digital Signal Processors
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Supply Voltage	1V
Frequency	1GHz
Base Part Number	320C6670
Pin Count	841
Interface	EBI/EMI, Ethernet MAC, PCIe, I2C, SPI, SRIO, UART
Max Supply Voltage	1.1V
Min Supply Voltage	900mV
Memory Size	1MB
Number of I/O	16
RAM Size	2kB
Memory Type	ROM
Bit Size	32
Data Bus Width	64b
Number of Timers/Counters	8
Boundary Scan	YES
Low Power Mode	YES
Voltage - I/O	1.0V 1.5V 1.8V
Number of UART Channels	1
Barrel Shifter	NO
Internal Bus Architecture	MULTIPLE
Non-Volatile Memory	ROM (128kB)
Voltage - Core	1.00V
On Chip Data RAM	6.25MB
Height Seated (Max)	3.39mm
Length	24mm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant
Lead Free	Contains Lead

Name

Value

Type

Parameter

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

841-BFBGA, FCBGA

Number of Pins

841

Operating Temperature

0°C~100°C TC

Packaging

Tube

Series

TMS320C66x

Pbfree Code

Part Status

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

841

Type

Fixed/Floating Point

Subcategory

Digital Signal Processors

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

BALL

Supply Voltage

Frequency

1GHz

Base Part Number

320C6670

Pin Count

841

Interface

EBI/EMI, Ethernet MAC, PCIe, I2C, SPI, SRIO, UART

Max Supply Voltage

1.1V

Min Supply Voltage

900mV

Memory Size

1MB

Number of I/O

RAM Size

2kB

Memory Type

ROM

Bit Size

Data Bus Width

64b

Number of Timers/Counters

Boundary Scan

YES

Low Power Mode

YES

Voltage - I/O

1.0V 1.5V 1.8V

Number of UART Channels

Barrel Shifter

Internal Bus Architecture

MULTIPLE

Non-Volatile Memory

ROM (128kB)

Voltage - Core

1.00V

On Chip Data RAM

6.25MB

Height Seated (Max)

3.39mm

Length

24mm

Radiation Hardening

RoHS Status

ROHS3 Compliant

Lead Free

Contains Lead

Quantity	Unit Price	Ext. Price
1	$227.20000	$227.2

TMX320C6670CYP Overview

In electronic terms, it is a type of component that comes in the package of type 841-BFBGA, FCBGA .Tube is the packaging method provided.Due to its membership in Fixed/Floating Point, it is ideally suited for a wide range of uses.There is a mounting point for it along the direction of Surface Mount.It is essential that 0°C~100°C TC is kept at a temperature that ensures proper operation of the machine.The analog voltage range of 1.0V 1.5V 1.8V refers to the voltage that can be input or ouput.As part of the TMS320C66x series, this digital signal processor is included.In terms of its uses, it has 841 terminations.It is supplied with voltage by 1V.841 components have pins.In its configuration, 841 pins can be found.Many related parts can be identified by using the 320C6670 part number as a base.It is specifically designed to operate with the frequency of 1GHz.Surface Mount is the method of mounting it.The device can be classified as part of the Digital Signal Processors subcategory based on its specific characteristics.In this device, the minimum voltage is 900mV.It can be supplied with a maximum voltage of 1.1V.Using this device, you can store 1MB data.1 UART channels are configured for asynchronous serial communication in which the data format and transmission speeds are configurable.Counting external events and measuring time are done by 8 timers/counters.16 I/Os are included with the device.ROM is the type of memory it uses.

TMX320C6670CYP Features

Supplied in the 841-BFBGA, FCBGA package
8 timers/counters
16 I/Os

TMX320C6670CYP Applications

There are a lot of Texas Instruments TMX320C6670CYP DSP applications.

Signal processing for telecommunications
Audio signal
Streaming music
Electronic information engineering
Automobile electronic gadgets
Digital image processing, data compression
Biomedical engineering
Telephone conversations
Remote sensing image processing technology
Computer vision technology