TMX320DM355ZCE270 Overview

The 337-LFBGA package contains these electronic components.Tray is the packaging method provided.Due to its membership in Digital Media System-on-Chip (DMSoC), it is ideally suited for a wide range of uses.Surface Mount is mounted in a manner that allows it to be moved.By operating the device at the temperature of 0°C~85°C TC, a normal operation is ensured.This refers to the analog voltage range that can be input or output from 1.8V 3.3V.The TMS320DM3x, DaVinci? series incorporates this digital signal processor.The use of it is terminated by 337.This device is powered by 1.3V's supply voltage.Pins are located on the 337 component.The configuration of this board includes 337 pins.With its base part number 320DM355, it is possible to identify a number of related parts.The device operates at the frequency of 270MHz in accordance with a specific design.The mounting method of the device is Surface Mount.This device falls into the subcategory of Digital Signal Processors based on its specific characteristics.It is possible to supply as low a voltage as 3.135V to this device.It can be supplied with a maximum voltage of 3.465V.There is an electric supply from 1.31.83.3V.The device is equipped with 104 I/Os.Memory type DDR2, FLASH, NAND, SDRAM, SRAM is used by it.The device contains 32 pieces of information.

TMX320DM355ZCE270 Features

Supplied in the 337-LFBGA package
104 I/Os

TMX320DM355ZCE270 Applications

There are a lot of Texas Instruments TMX320DM355ZCE270 DSP applications.

• Other sensor array processing
• Image compression
• MP3 audio player
• Boats
• Digital image processing
• Vibration signal processing
• Automobiles
• Infrared
• Audio compression
• Receivers