TRS3232IDBRG4 Overview

An excellent driver IC for common LEDs thanks to its enhanced 16-SSOP (0.209, 5.30mm Width) package.Tape & Reel (TR) package is used for this receiver.It has proved to be a valuable component for a variety of applications since it is a Transceiver can transceiver.You can place this wide receiver to any Surface Mount-type PCB or development board.This differential driver uses 3V~5.5V for power supply.At any given time, there can be up to 2/2 eligible receivers/drivers for this electronic part.As its name implies, this ic receiver is designed for applications where -40°C~85°C is the operating temperature.With a supply voltage range of 3.3V, this line driver ic operates efficiently.This integrated circuit has 16 terminations designed for driving and receiving signals from data.The pinouts for this transceiver are standardized to meet the needs of the market.As the base part number TRS3232 identifies the product type, temperature, package, etc., you can try searching with it to get more variants of this part.Wide receiver with enhanced power dissipation control, 16-pin.Its package size is drastically reduced by downsizing ICs and utilizing high-density Surface Mount mounting techniques.In most cases, the receiver will be specified with a 2-bit resolution.This transceiver module is designed to operate from an input voltage supply of 3.6V.There is a subcategory called Line Driver or Receivers for this rf transceiver module.An 8-pin power supply is provided by this driver IC, which allows it to operate from an 3.3/5V-pin power supply.This electronic part can have?up to 2 eligible drivers on the field at once.?A ALSO OPERATES AT 5V SUPPLY function is also included on this optical transceiver module, which improves the overall signal management accuracy and stability.

TRS3232IDBRG4 Features

Tape & Reel (TR) package
16 pin count
16 pins
3.3/5V power supply

TRS3232IDBRG4 Applications

There are a lot of Texas Instruments TRS3232IDBRG4 Drivers/Receivers/Transceivers applications.

• Aircraft navigation
• Indoor ad hoc meeting
• Laser diode bonding
• Wireless interactive experience
• Wireless transmission
• Notebook
• Single to Multimode Fiber Conversion
• Carrier phase observations
• Thermal management
• Data center