TRSF3232IDWR Overview

With the enhanced 16-SOIC (0.295, 7.50mm Width) package, this driver IC is excellent for driving common LEDs.There is a Tape & Reel (TR) package for this receiver.Since this part is a Transceiver can transceiver, a number of solutions have been able to utiliTransceivere it for various purposes.PCBs or development boards with Surface Mount-types can accommodate this wide receiver.A power supply of 3V~5.5V is used by this differential driver.The field can have up to 2/2 eligible receivers/drivers at once when using this electronic part.As its name implies, this ic receiver is designed for applications where -40°C~85°C is the operating temperature.An output voltage range of 3.3V is sufficient to run this line driver ic efficiently.There are 16 terminations in this wide receiver so that signals can be driven from the data and received.It is packaged with 16 pinouts that are market standard for this particular transceiver.You can search with TRSF3232 to get more variants of this part, since it identifies the product type, temperature, package, etc.The driver IC has improved power dissipation control.Through optical transceiver downsizing and high-density Surface Mount mounting technologies, its package size is reduced dramatically.In the case of this receiver, a resolution of 2 bits is typically specified.As a result of the design of this transceiver module, the input voltage supply is designed to operate at 5V.3 volts.There are 1 transceivers implemented in this module isolated transceiver.The part is embedded with 2 drivers, so it can be used with 2 devices.A ALSO OPERATED AT 5V SUPPLY function is also included on this optical transceiver module, which improves the overall signal management accuracy and stability.A malfunction could occur when the input current exceeds 1mA.

TRSF3232IDWR Features

Tape & Reel (TR) package
16 pin count
16 pins

TRSF3232IDWR Applications

There are a lot of Texas Instruments TRSF3232IDWR Drivers/Receivers/Transceivers applications.

• Vehicle
• Wireless projection application for conferences
• Long-distance fiber optic network applications
• Carrier phase observations
• Indoor ad hoc meeting
• Wireless security systems
• Sensor reporting
• Optical sub-assembly (OSA)
• Structural bonding
• LAN, SAN, WAN (local, storage, work area networks)