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XC6122E650ER-G

XC6122E650ER-G

XC6122E650ER-G

Torex Semiconductor Ltd

6 Terminals Voltage supervisor

SOT-23

XC6122E650ER-G Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-UFDFN Exposed Pad
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2014
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
Type Watchdog Circuit
Terminal Finish Nickel/Silver/Gold (Ni/Ag/Au)
Subcategory Power Management Circuits
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Terminal Pitch 0.5mm
Output Open Drain or Open Collector
JESD-30 Code R-PDSO-N6
Qualification Status Not Qualified
Reset Active Low
Voltage - Threshold 5V
Number of Voltages Monitored 1
Reset Timeout 1.6s Typical
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.48160 $1.4448
XC6122E650ER-G Product Details

XC6122E650ER-G Overview


As far as the mounting terminals of this voltage supervisor are concerned, it has 6 in total. Power management is packaged in a Tape & Reel (TR) way. IC management is packaged as a 6-UFDFN Exposed Pad package. There are a lot of similarities between this IC management and other Watchdog Circuit products. IC management conducts in a 1-voltage supply. Surface Mount mounts power management on the wall. In this case, this PMIC chip can be sub-categorized as a Power Management Circuits chip. The recommended mounting type for IC management is Surface Mount. It is recommended that the supervisor be set to this temperature: -40°C~85°C TA. While this power management is operating, it will output Open Drain or Open Collector as the output voltage.

XC6122E650ER-G Features


Watchdog Circuit type

XC6122E650ER-G Applications


There are a lot of Torex Semiconductor Ltd XC6122E650ER-G Voltage Supervisors applications.

  • Medical-specific insulation monitor
  • DC stabilized power supply module
  • Power communication system
  • Embedded computing
  • Battery-powered equipment
  • Low voltage/high power - AI, GPU
  • Functional modules
  • Detection of phase sequence
  • Display equipment
  • Telecommunications equipment

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