I have embedded this device in 25-SIP Formed Leads .The chip is recommended to be packaged in Tube case. Amp parts is mounted in front of Through Hole .The TB2955 family includes it.There is an electronic part in the way of Through Hole .
TB2955HQ(O) Features
25-SIP Formed Leads package TB2955 family
TB2955HQ(O) Applications
There are a lot of Toshiba Semiconductor and Storage TB2955HQ(O) audio amplifiers applications.