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TD62004AFG,N,EL

TD62004AFG,N,EL

TD62004AFG,N,EL

Toshiba Semiconductor and Storage

16 Pin Receivers7/0 Drivers/Receivers

SOT-23

TD62004AFG,N,EL Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-SOIC (0.173, 4.40mm Width)
Number of Pins 16
Supplier Device Package 16-SOP
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2009
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Driver
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 0V~50V
Number of Drivers/Receivers 7/0
RoHS Status RoHS Compliant
TD62004AFG,N,EL Product Details

TD62004AFG,N,EL Overview


An excellent driver IC for common LEDs thanks to its enhanced 16-SOIC (0.173, 4.40mm Width) package.There is a Tape & Reel (TR) package for this receiver.With its Driver can transceiver design, this part can be incorporated into a wide range of solutions.On any Surface Mount-type PCB or development board, this wide receiver can be placed.This differential driver requires a 0V~50V power supply.The field can have up to 7/0 eligible receivers/drivers at once when using this electronic part.IC receiver's like this are designed for applications requiring a -40°C~85°C operating temperature.An enhanced power dissipation control driver IC featuring 16 pins.Package size is drastically reduced by downsizing ICs and mounting them in high-density Surface Mount arrays.Under 85°C, the operating transceiver module's temperature must be kept below.There must be at least -40°C minimum operating temperature for this optical transceiver.As a result of this wide receiver utilizing the 16-SOP supplier package, it is power efficient.

TD62004AFG,N,EL Features


Tape & Reel (TR) package
16 pins

TD62004AFG,N,EL Applications


There are a lot of Toshiba Semiconductor and Storage TD62004AFG,N,EL Drivers/Receivers/Transceivers applications.

  • Interconnection between switches and computers
  • Bar, KTV wireless entertainment
  • Telecom applications
  • Satellite communications networks
  • Low power, low voltage systems
  • Wireless smart house
  • Servers
  • Structural bonding
  • Ship
  • Wireless modems

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