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TE0300-01IBM

TE0300-01IBM

TE0300-01IBM

Trenz Electronic GmbH

TE0300-01IBM datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0300-01IBM Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Operating Temperature 0°C~70°C
Published 2009
Series TE0300
Size / Dimension 1.6 x 1.9 40.5mmx47.5mm
Part Status Not For New Designs
Connector Type B2B
Speed 125MHz
RAM Size 64MB
Core Processor Spartan-3E
Module/Board Type FPGA, USB Core
Flash Size 4MB
Co-Processor Cypress FX2 USB 2.0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $167.28000 $167.28
TE0300-01IBM Product Details

TE0300-01IBM Overview


A FPGA, USB Core module or board is used in the microcontroller.Microprocessor chip is powered by a processor with a total of Spartan-3E cores in it.In order to use the microcontroller, the default setting is 0°C~70°C.4MB is the size of the flash on the MCU electronics.The connector type B2B refers to the connector type.The TE0300 Series is the group in which MCU chip belongs.This is 64MB in order to guarantee that the software runs normally.125MHz speed is the speed of the MCU chip.There is a Cypress FX2 USB 2.0 Core Processor in it.

TE0300-01IBM Features


Core processor of Spartan-3E
Flash size of 4MB
Speed of 125MHz

TE0300-01IBM Applications


There are a lot of Trenz Electronic GmbH TE0300-01IBM Microcontroller, Microprocessor, FPGA Modules applications.

  • Power Protection Systems
  • Test and Measurement
  • Medical Devices
  • Software Defined Radio
  • Data Acquisition
  • Industrial Instrumentation
  • Patient Monitoring
  • Embedded Control Processing
  • Process Control
  • Industrial Automation

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