TE0300-01IBM datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0300-01IBM Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~70°C
Published
2009
Series
TE0300
Size / Dimension
1.6 x 1.9 40.5mmx47.5mm
Part Status
Not For New Designs
Connector Type
B2B
Speed
125MHz
RAM Size
64MB
Core Processor
Spartan-3E
Module/Board Type
FPGA, USB Core
Flash Size
4MB
Co-Processor
Cypress FX2 USB 2.0
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$167.28000
$167.28
TE0300-01IBM Product Details
TE0300-01IBM Overview
A FPGA, USB Core module or board is used in the microcontroller.Microprocessor chip is powered by a processor with a total of Spartan-3E cores in it.In order to use the microcontroller, the default setting is 0°C~70°C.4MB is the size of the flash on the MCU electronics.The connector type B2B refers to the connector type.The TE0300 Series is the group in which MCU chip belongs.This is 64MB in order to guarantee that the software runs normally.125MHz speed is the speed of the MCU chip.There is a Cypress FX2 USB 2.0 Core Processor in it.
TE0300-01IBM Features
Core processor of Spartan-3E Flash size of 4MB Speed of 125MHz
TE0300-01IBM Applications
There are a lot of Trenz Electronic GmbH TE0300-01IBM Microcontroller, Microprocessor, FPGA Modules applications.