TE0803-01-02EG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-01-02EG-1EA Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.99 x 2.05 76mmx52mm
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU2EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-01-02EG-1EA Product Details
TE0803-01-02EG-1EA Overview
A MPU Core-type board or module is used in this microcontroller.There are Zynq UltraScale+ XCZU2EG-1SFVC784E cores in its processor, which is what powers the microcontroller.Microcontroller settings default to 0°C~85°C.The size of the flash on the MCU electronics is 128MB.The connector type is B2B.MCU chip belongs to the TE0803 Series.The RAM is reduced to 2GB in order to ensure that the software is able to run normally.
TE0803-01-02EG-1EA Features
Core processor of Zynq UltraScale+ XCZU2EG-1SFVC784E Flash size of 128MB
TE0803-01-02EG-1EA Applications
There are a lot of Trenz Electronic GmbH TE0803-01-02EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.