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TE0803-01-02EG-1EA

TE0803-01-02EG-1EA

TE0803-01-02EG-1EA

Trenz Electronic GmbH

TE0803-01-02EG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-01-02EG-1EA Datasheet

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Specifications
Name Value
Type Parameter
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.99 x 2.05 76mmx52mm
Part Status Discontinued
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU2EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
TE0803-01-02EG-1EA Product Details

TE0803-01-02EG-1EA Overview


A MPU Core-type board or module is used in this microcontroller.There are Zynq UltraScale+ XCZU2EG-1SFVC784E cores in its processor, which is what powers the microcontroller.Microcontroller settings default to 0°C~85°C.The size of the flash on the MCU electronics is 128MB.The connector type is B2B.MCU chip belongs to the TE0803 Series.The RAM is reduced to 2GB in order to ensure that the software is able to run normally.

TE0803-01-02EG-1EA Features


Core processor of Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash size of 128MB

TE0803-01-02EG-1EA Applications


There are a lot of Trenz Electronic GmbH TE0803-01-02EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.

  • Embedded User Interfaces
  • Process Monitoring
  • Process Control
  • Network Enabled Data Acquisition
  • Embedded Instrumentation
  • Test and Measurement
  • IoT Secure Gateways
  • Human Machine Control Panel
  • Medical Devices
  • Industrial Control

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