TE0803-02-02EG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-02-02EG-1EA Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU2EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-02-02EG-1EA Product Details
TE0803-02-02EG-1EA Overview
The microcontroller has been classified as a MPU Core type module or board.An integral MCU electronics of it is a processor with Zynq UltraScale+ XCZU2EG-1SFVC784E cores that drives the whole thing.It is not surprising that 0°C~85°C is the microcontroller's default setting.128MB is the size of the flash on the MCU electronics.There are two types of connectors. The first is B2B.This MCUs belongs to the TE0803 Series of MCUs.This is 2GB in order to guarantee that the software runs normally.
TE0803-02-02EG-1EA Features
Core processor of Zynq UltraScale+ XCZU2EG-1SFVC784E Flash size of 128MB
TE0803-02-02EG-1EA Applications
There are a lot of Trenz Electronic GmbH TE0803-02-02EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.